Advanced MEMS and Sensor Packaging Solutions

Our MEMS and sensor packaging solutions provide sophisticated encasements designed to facilitate optimal electrical connectivity, efficiently delivering signals to the circuit boards of electronic devices. These advanced packages also offer robust protection for MEMS and sensors against potentially damaging external elements and the corrosive effects of time, ensuring long-term reliability and performance.

MEMS AND SENSOR PACKAGING SOLUTIONS

  • Versatile Applications: Serving communication, consumer, industrial, and automative sectors
  • Integrated Functionality: Supporting various components including RF devices, pressure sensors, microphones, accelerometers, gyroscopes, inertial components, inkjet print heads, and optical devices
  • Multifaceted sensing: Enabling measurement of temperature, pressure, magnetic fields, radiation, fluid flow, and motor performance

Applications of MEMS Technology

MEMS Integrations spans diverse components, including RF device, pressure Sensors, microphones, accelerometers, gyroscopes, inertial components, Inkjet print heads, optical devices, among others. This technology permeates industries such as consumer electronics, automotive, healthcare and industrial automation.

Key applications: Sensory solutions
  • Primary MEMS excels in pressure, chemical, inertial, and infrared sensing, forming the backbone of Internet of Things and automation technologies.
Notable Implementations:
  1. Intelligent HVAC (“Heating, Ventilation and Air conditioning”) systems
  2. Atmospheric gas detection and analysis
  3. Precision hydraulic measurement in consumer appliances such as coffee makers
  4. High-definition projection via micro-mirror arrays
  5. Multifunctional automotive sensing (acceleration, gyroscope, pressure, gas, temperature)
  6. Miniaturised mobile device sensors (gyroscopes, barometers, accelerometers and microphones)